• Skip to main content
  • Skip to primary navigation
  • Departments
    • Bioengineering
    • Civil and Environmental Engineering
    • Electrical Engineering and Computer Sciences
    • Industrial Engineering and Operations Research
    • Materials Science and Engineering
    • Mechanical Engineering
    • Nuclear Engineering
    • Aerospace program
    • Engineering Science program
  • News
    • Berkeley Engineer magazine
    • Social media
    • News videos
    • News digest (email)
    • Press kit
  • Events
    • Events calendar
    • Commencement
    • Homecoming
    • Cal Day
    • Space reservations
    • View from the Top
    • Kuh Lecture Series
    • Minner Lecture
  • College directory
  • For staff & faculty
Berkeley Engineering

Berkeley Engineering

Educating leaders. Creating knowledge. Serving society.

  • About
    • Facts & figures
    • Rankings
    • Mission & values
    • Equity & inclusion
    • Voices of Berkeley Engineering
    • Leadership team
    • Milestones
    • Buildings & facilities
    • Maps
  • Admissions
    • Undergraduate admissions
    • Graduate admissions
    • New students
    • Visit
    • Maps
    • Admissions events
    • K-12 outreach
  • Academics
    • Undergraduate programs
    • Majors & minors
    • Undergraduate Guide
    • Graduate programs
    • Graduate Guide
    • Innovation & entrepreneurship
    • Kresge Engineering Library
    • International programs
    • Executive education
  • Students
    • New students
    • Advising & counseling
    • ESS programs
    • CAEE academic support
    • Student life
    • Wellness & inclusion
    • Undergraduate Guide
    • > Degree requirements
    • > Policies & procedures
    • Forms & petitions
    • Resources
  • Research & faculty
    • Centers & institutes
    • Undergrad research
    • Faculty
    • Sustainability and resiliency
  • Connect
    • Alumni
    • Industry
    • Give
    • Stay in touch
Home > News

Manufacturing

3D fractal tree antenna

Antenna evolution

06/11/25 — A new 3D printing platform provides design flexibility and rapid production of intricate antenna structures.
Sayeef Salahuddin, EEC professor.

Sayeef Salahuddin named to NSTC Technical Advisory Board

05/01/25 — EECS professor will help shape the National Semiconductor Technology Center Research Agenda, advance U.S.-led innovation and economic and national security
Shot of more than 20 people in a room wearing clean suits. The people are listening to a person talking and pointing to the right.

UC Berkeley’s Marvell NanoLab gets high-tech boost with Lam Research gift

04/16/25 — Sophisticated etching system enables atomic-scale precision for next-generation chips
Mark Liu, former executive chairman of Taiwan Semiconductor Manufacturing Co. (TSMC), speaking at a podium. To ensure American technology competitiveness in the long term, Liu is establishing the Technology Competitiveness and Industrial Policy Center at the University of California, Berkeley.

New UC Berkeley center to address American competitiveness in advanced technology

02/24/25 — The academic center will engage experts in technology, economics and policy from across academia, industry and non-profit organizations
A 3D fractal tree antenna fabricated using charge programmed multi-material 3D printing (CPD).

Tuning in to the possibilities of 3D-printed antenna technology

01/08/25 — A new additive manufacturing platform could revolutionize how antennas are printed and open a range of design possibilities
SpaceCAL 3D printer awaiting June 2024 launch on VSS Unity; Taylor Waddell (inset)

Manufacturing in microgravity

11/20/24 — Berkeley researchers sent their 3D printing technology to space as part of the Virgin Galactic 07 mission.
Close-up of a blue-gloved hand constructing a microchip.

UC helps bring first-of-its-kind semiconductor hub to California

11/12/24 — UC Newsroom: Berkeley Engineering will collaborate with Natcast to launch a Visiting Scholars program
Three individuals are pictured in separate circular frames against a background of a green circuit board. The person on the left has a beard and short dark hair, wearing a blue shirt. The person in the center has long black hair and is smiling, wearing a dark shirt. The person on the right has a beard and is wearing a suit jacket over a white shirt.

New computer simulations help scientists advance energy-efficient microelectronics

09/13/24 — Berkeley Lab: EECS professor Sayeef Salahuddin part of team working to fast-track the development of ultra-low-power microelectronics
Spaceflight feather, as viewed aboard VSS Unity on June 8, 2024. The Virgin Galactic 07 flight carried Berkeley’s SpaceCal 3D printer and four other research payloads.

Berkeley researchers send 3D printer into space

07/02/24 — SpaceCAL tests the limits of additive manufacturing on Virgin Galactic 07 mission
Pyramid-textured sound insulation lit by colored lights

Grand designs

05/31/24 — An innovative design method leverages AI and additive manufacturing to create better-performing materials.
A collage of photos shows scientists working in different types of lab environments.

Berkeley’s ecosystem of innovation and entrepreneurship combats climate change

05/30/24 — UC Berkeley faculty are fast-tracking the development of new and creative climate solutions
Futuristic batteries on top of a computer chip emitting powerful lightning bolts, neon blue colors, black background.

Researchers achieve giant energy storage, power density on a microchip

05/06/24 — New generation of electrostatic capacitors could change the energy storage paradigm for microelectronics
Schematic illustration of the COF structure, polymer and nanofibrils.

Molecular weaving makes polymer composites stronger without compromising function

03/21/24 — College of Chemistry: New discovery could have a “huge impact on the materials industry”
Photo of Eiffel Tower-shaped luminescent structures 3D-printed from supramolecular ink. Each 2-centimeter-tall device is fabricated from supramolecular ink that emits blue or green light when exposed to 254-nanometer ultraviolet light.

Scientists advance affordable, sustainable solution for flat-panel displays and wearable tech

01/22/24 — Berkeley Lab: New 3D-printable material could enable cheaper manufacturing processes for next-gen OLED televisions, smartphones, light fixtures and wearable devices
Transmission electron microscope (TEM) images of the new 2D nanosheet as a barrier coating that self-assembles on a variety of substrates. The TEM experiments were conducted at UC Berkeley’s Electron Microscope Laboratory.

Scaling up nano for sustainable manufacturing

11/08/23 — Berkeley Lab: Scientists, led by Berkeley engineer Ting Xu, have developed multipurpose, recyclable nanosheets for electronics, energy storage, and health and safety applications
Photo of a nanoscale 3D printing benchmarking model called a "3DBenchy" showcases how a new 3D printing technique enabled researchers to embed nitrogen vacancy centers in complex, microscale 3D structures.

Researchers demonstrate new 3D printing technique for quantum sensors

10/31/23 — Innovation may lead to novel applications in precision measurement, biological imaging and environmental monitoring
Image of soundproofing material under red and blue lighting.

Researchers develop new AI-based design method for metamaterials

10/10/23 — Innovative approach can create everyday products with novel mechanical properties
Image of Grace Gu with microchip in the background, along with an image depicting AI, University of California, and Lawrence Livermore National Laboratory.

Grace Gu selected as inaugural recipient of the LLNL Early Career UC Faculty Initiative

10/02/23 — LLNL: Assistant professor of mechanical engineering to receive $1M as part of LLNL, University of California partnership for AI-driven additive manufacturing research
Image of silicon wafers.

Accelerating sustainable semiconductors with ‘multielement ink’

09/28/23 — Berkeley Lab: New material developed by Berkeley engineers could enable green, low-carbon manufacturing of next-gen microelectronics
Dean Tsu-Jae King Liu speaks at a CHIPS and Science Act press event

Dean’s note: The CHIPS Act: A call to action

11/07/22 — Berkeley Engineering will play a prominent role in efforts to address the workforce needs of the U.S. semiconductor industry.
  • Go to page 1
  • Go to page 2
  • Go to Next Page »
  • Contact
  • Give
  • Privacy
  • UC Berkeley
  • Accessibility
  • Nondiscrimination
  • instagram
  • X logo
  • linkedin
  • facebook
  • youtube
  • bluesky
© 2025 UC Regents