Solid State Technology and Devices Seminar

Microassembler Printer

Eugene Chow, PARC


1:00pm - 2:00pm

Location: 521 Hogan Room, Cory Hall

We are developing a process to assemble and orient micro-objects, and then transfer them to a final substrate to be used for electronics, sensors, metamaterials and other applications. The process uses directed electrostatic assembly to enable micrometer scale registration and parallel assembly with open and closed loop control. We transfer the assemblies to final substrates with parallel or roll based-based methods.

  • Sponsor:

    Electrical Engineering and Computer Sciences (EECS)
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